Method of coating a substrate with copper

C - Chemistry – Metallurgy – 23 – C

Patent

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C23C 18/14 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2147522

Abstract of the Disclosure A method of coating a substrate with copper which involves applying to the substrate an aqueous copper formate solution and irradiating the substrate to which the copper formate solution has been applied with radiation from an excimer lamp having a wavelength effective to coat the substrate with copper. Such radiation desirably has a wavelength of 172 nm. The aqueous copper formate solution includes water, copper formate, a surfactant, and an effective amount of a photo-redox facilitator.

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