Electronic device having dewing prevention structure and...

Details Electronic device having dewing prevention structure and... Electronic device having dewing prevention structure and...

H - Electricity

01

L

H01L 23/34 (2006.01) H01L 23/367 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2387252

The electronic device includes a semiconductor device, a substrate on which the semiconductor device is mounted, a flange member for holding a peripheral portion of the substrate and a cooling member, in which the flange member for supporting the substrate of the semiconductor device being thermally in contact with the cooling member is arranged to come into contact with a heater through an adapter and between the heater and the cooling member, a heat insulating material is filled.

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