Method for manufacturing of a multilayer microwave board and...

H - Electricity – 05 – K

Patent

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H05K 1/02 (2006.01) H01P 11/00 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2142178

Method for manufacturing a multilayer microwave board in one operation. Individually etched layers of a laminate, such as duroid, are bonded to form a package and drilled after which the resulting holes are plated. Next, the superfluous connections are removed by drilling during which process each stripline-coax transition buried in the package is tuned by a correct selection of the drill diameter and the hole depth.

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