Process for hydrosonically area embossing thin thermoplastic...

B - Operations – Transporting – 29 – C

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B29C 59/16 (2006.01) B29C 59/02 (2006.01)

Patent

CA 2089927

ABSTRACT OF THE DISCLOSURE The invention is directed to a method for forming embossed areas in a thin thermoplastic film material and the products formed thereby. The method includes the steps of (1) placing the thin thermoplastic film material on a pattern anvil having a pattern of raised areas wherein the height of the raised areas is generally less than the thickness of the film material; (2) conveying the thermoplastic film material, while placed on the pattern anvil, through an area where a liquid is applied to the film material; and (3) subjecting the thermoplastic film material to a sufficient amount of ultrasonic vibrations in the area where the liquid is applied to the film material to emboss the film material in a pattern generally the same as the pattern of raised areas on the pattern anvil. 37

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