Cutting tools in band form

Details Cutting tools in band form Cutting tools in band form

B - Operations, Transporting

23

P

B23P 15/28 (2006.01) B22F 7/08 (2006.01) B23D 63/00 (2006.01) B23D 65/00 (2006.01) B23K 26/14 (2006.01) B23K 26/34 (2006.01) B23P 15/40 (2006.01)

Patent

CA 2451514

The invention relates to a method for the production of a cutting tool, more particularly saws, cutting rules or punching tools, comprising a band-shaped or disc-shaped support material (1); a cutting area (2) in the form of a powder alloy is applied on the edge of said support material, which is located substantially edgewise, and said cutting area is melted during application, preferably by means of a laser beam, and then hardened on said edge. The invention is characterized in that at least the cutting area (2) projecting beyond the side surface of the support material (2) is subjected to heat forming in the area of the support strip on which the powder material has already been applied and in which hardening takes place. In another embodiment, threshold intensity of the laser beam for plasma formation is not exceeded once the laser beam strikes the material to be melted. The invention also relates to embodiments, a device for implementing the method and the tools thus produced or their blanks.

L'invention concerne un procédé pour fabriquer un outil d'enlèvement des copeaux, notamment de scies, de lignes de coupe et d'emporte-pièces, cet outil étant constitué d'un matériau support (1) en forme de bande ou de disque, où, sur le bord sensiblement sur chant, une zone de coupe (2) est réalisée sous forme d'un alliage pulvérulent, fondant lors de son application, de préférence au moyen d'un faisceau laser, et se solidifiant sur ledit bord. L'invention est caractérisée en ce que, dans la zone de la bande support sur laquelle le matériau pulvérulent est appliqué et se solidifie, au moins la zone de coupe (2) en saillie par rapport à la surface latérale du matériau support est soumise à un formage à chaud. Dans un mode de réalisation, pour la formation du plasma, le seuil d'intensité du faisceau laser n'est pas dépassé, lorsque le laser est incident sur le matériau à fondre. La présente invention porte également sur différents modes de réalisation, sur un dispositif servant à appliquer ce procédé et sur les outils ou les ébauches ainsi fabriqués.

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