Infrared sensor and method of manufacturing the same

H - Electricity – 01 – L

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Details

H01L 31/04 (2006.01) C23C 14/08 (2006.01) G01J 5/12 (2006.01) H01L 35/00 (2006.01) H01L 35/34 (2006.01)

Patent

CA 2305099

A SiO2 layer is formed on a heat sink section having a cavity by thermal oxidation and an aluminum oxide layer is formed on the SiO2 layer by an electron beam evaporation process at a substrate temperature of 60°C or less and at a deposition rate of 0.8 nm/s or less. The resulting aluminum oxide film is amorphous and has partial oxygen defects. The SiO2 layer and the aluminum oxide layer constitute a heat insulating thin-film. A thermoelectric conversion element and an infrared-absorbing layer are formed on the heat insulating thin-film to form an infrared sensor. The infrared sensor can be produced at low production costs and has high sensitivity.

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