Laser, direct-write integrated circuit production system

H - Electricity – 01 – L

Patent

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Details

356/177, 88/96.2

H01L 21/027 (2006.01) B23K 26/06 (2006.01) B23K 26/08 (2006.01) G02B 26/10 (2006.01) G03F 7/20 (2006.01)

Patent

CA 2037828

LASER, DIRECT-WRITE INTEGRATED CIRCUIT PRODUCTION SYSTEM ABSTRACT OF THE DISCLOSURE A laser, direct-write system for making personal- ized custom or semi-custom integrated circuits with a very fast turnaround time. The system includes a method and apparatus for high precision scanning of a submicron laser spot. The laser beam is scanned at the entrance of a beam expander. The beam expander reduces the scan angle and error produced by a mechanical scanning device such as a rotating polygonal mirror. The smaller scan angle at the output of the beam expander matches well with the projec- tion optics of a laser, direct-write semi-custom integrated circuit production system. The scan error reduction permits more accurate positioning of the focussed laser spot on the surface of the semi-custom integrated circuit.

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