Improved method and apparatus for a surface-mounted fuse device

H - Electricity – 01 – H

Patent

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Details

H01H 85/041 (2006.01) H01H 69/02 (2006.01) H01H 85/046 (2006.01) H01H 85/11 (2006.01)

Patent

CA 2224070

A thin film surface-mount fuse (58) having two material subassemblies. The first subassembly includes a fusible link (42), its supporting substrate (13) and terminal pads (34, 36). The second subassembly includes a protective layer (56) which overlies the fusible link (42) so as to provide protection from impacts and oxidation. The protective layer (56) is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.

L'invention concerne un fusible monté en surface (58) à couche mince comportant deux sous-ensembles matière. Le premier sous-ensemble comprend une liaison fusible (42), son substrat de support (13) et ses plots terminaux (34, 36). Le deuxième sous-ensemble comprend une couche protectrice (56) qui recouvre la liaison fusible (42) de manière à assurer une protection contre les chocs et l'oxydation. Cette couche protectrice (56) est de préférence constituée d'un materiau polymère. Le matériau polymère idéal est un gel ou une pâte de polyuréthane. En outre, le substrat de support idéal est une époxy FR-4 ou un polyimide.

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