Method for the dissolution of copper particles formed during...

Details Method for the dissolution of copper particles formed during... Method for the dissolution of copper particles formed during...

C - Chemistry, Metallurgy

23

C

204/36, 117/80

C23C 18/40 (2006.01) C23C 18/54 (2006.01) C25D 3/38 (2006.01)

Patent

CA 2009131

ABSTRACT OF THE DISCLOSURE Non-adherent copper metal particles ("fines") formed in a plating bath during the course of autocatalytic electroless copper deposition onto activated substrate surfaces are oxidized and redissolved in the bath by brief application of current between an anode element and a cathode element immersed in the bath, the anode element being comprised of an anode surface substantially parallel and proximate to the bottom surface of the vessel containing the bath.

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