Hermetically sealing enclosure for housing...

Details Hermetically sealing enclosure for housing... Hermetically sealing enclosure for housing...

H - Electricity

01

L

H01L 23/10 (2006.01) G02B 6/42 (2006.01) H01L 23/52 (2006.01) H01L 31/02 (2006.01) H01L 31/0203 (2006.01)

Patent

CA 2388890

A hermetically sealing enclosure for housing photo-semiconductor devices that reduces the heat generated in the wiring strips at the ceramic terminal mem- ber, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal mem- ber is provided with a first wiring layer that comprises a plurality of wiring strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of which is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connects the two second wiring layers.

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