Low profile modular jack

Details Low profile modular jack Low profile modular jack

H - Electricity

01

R

H01R 12/34 (2006.01) H01R 12/20 (2006.01) H01R 24/04 (2006.01)

Patent

CA 2299981

A receptacle and printed circuit board combination for receiving a telecommunications plug and achieving electrical connection between the plug and the printed circuit board is provided. The combination occupies a minimum required amount of space and requires a minimum amount of material. The combination comprises an insulating housing, a plurality of electrical contacts, and a printed circuit board, wherein the housing and circuit board form a plug receiving opening. The printed circuit board has a cut-out portion for receiving the receptacle. Preferably, the receptacle further comprises two latches extending from a bottom surface of the housing for mounting the receptacle on the circuit board, wherein the cut- out portion of the circuit board receives the peg. In certain preferred embodiments, the housing further comprises two ledges, each extending from a sidewall of the housing. In additional preferred embodiments, the ledges have respective ledge extensions extending down from the ledges at the front of the housing to help anchor the receptacle in place on the circuit board by making contact with a leading edge of the circuit board. In other preferred embodiments, the ledge extensions have respective lips extending from the ledge extensions toward each other such that the receptacle can receive a latch arm of the telecommunications plug.

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