Process for decreasing the resistivity of conductive flow...

Details Process for decreasing the resistivity of conductive flow... Process for decreasing the resistivity of conductive flow...

H - Electricity

01

M

H01M 8/02 (2006.01) C08K 7/06 (2006.01) H01B 1/24 (2006.01)

Patent

CA 2479874

The present invention provides a process for decreasing the resistivity of a non-machined conductive flow field plate for use in a fuel cell. The flow filed plate may contain graphite filled polymer. The process includes the step of annealing the conductive flow field plate by heating the conductive flow field plate to a temperature between 25 ~C (room temperature) and a temperature slightly lower than the material softening temperature of the material composition of the conductive flow field plate; maintaining the conductive flow field plate at that temperature for an effective period of time; and, cooling the conductive flow field plate to room temperature.

L'invention concerne un procédé de réduction de la résistivité d'une plaque à champ d'écoulement non usinée à utiliser dans une pile à combustible. Ledit procédé comprend : une étape de recuit de la plaque à champ d'écoulement qui consiste à porter ladite plaque à une température comprise entre 25 ·C (température ambiante) et une température légèrement inférieure à la température de ramollissement de matière de la composition de ladite plaque ; une étape de maintien de la plaque à champ d'écoulement conductrice à cette température sur une durée effective ; et une étape de refroidissement de la plaque à champ d'écoulement conductrice jusqu'à ce qu'elle soit à la température ambiante.

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