H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/02 (2006.01) H05K 1/11 (2006.01) H05K 3/46 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2283150
Printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices To increase the packing density of electronic circuits and conductor-track structures on printed circuit boards for electrical devices having RF components, particularly for mobile radio telecommunication devices, a "micro via" coating is initially applied to one or both sides of a printed circuit board assembly. This "micro via" coating then has, in particular, RF circuits and RF conductor-track structures applied to at least part of its surface. Finally, the RF circuits and RF conductor-track structures are protected in relation to an RF ground coating of the printed circuit board assembly by barrier areas arranged in an assembly coating, situated directly below the "micro via" coating, of the printed circuit board assembly against interfering influences which impair the RF parameters, to be set in each case, of the RF circuits and RF conductor-track structures.
L'invention vise à accroître la densité de composants de circuits électroniques et de structures de tracés conducteurs sur des circuits intégrés destinés à des appareils électriques à composants HF, notamment des appareils de radiotélécommunications mobiles. A cet effet, une couche "micro via" (M2) est tout d'abord appliquée sur un ou deux côtés d'un substrat de carte de circuits (LPT4). Ensuite, des circuits HF et des structures de tracés conducteurs HF (LBS3HF) notamment, sont placés au moins sur une partie de la surface de cette couche "micro via" (M2). Les circuits HF et les structures de tracés conducteurs HF (LBS3HF) sont protégés vis-à-vis d'une couche de masse HF (MS5HF) du substrat de carte de circuits, par des zones de blocage (SB3) placées dans une couche support (LPL2) du substrat de carte de circuits, située directement sous la couche "micro via" (M2), contre des influences perturbatrices affectant les paramètres HF à fixer des circuits HF et des structures de tracés conducteurs HF (LBS3HF).
Aktiengesellschaft Siemens
Fetherstonhaugh & Co.
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