Polyimide adhesion enhancement to polyimide film

Details Polyimide adhesion enhancement to polyimide film Polyimide adhesion enhancement to polyimide film

H - Electricity

05

K

H05K 3/38 (2006.01) B32B 15/08 (2006.01)

Patent

CA 2441103

The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil coated with a polyimide film is laminated onto an etched surface of a polyimide substrate. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.

L'invention concerne la production de cartes de circuits imprimés dont l'adhérence intercouche est améliorée. L'invention concerne plus particulièrement des cartes de circuits imprimés sans adhésif présentant une excellente résistance thermique et s'utilisant pour produire des circuits à haute densité. Une feuille métallique recouverte d'un film polyimide est stratifiée sur une surface gravée d'un substrat polyimide. Le fait de graver la surface du substrat permet à une pellicule polyimide pure d'adhérer fortement au substrat.

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