G - Physics – 08 – B
Patent
G - Physics
08
B
G08B 13/24 (2006.01) G01S 13/75 (2006.01) G06K 19/077 (2006.01)
Patent
CA 2185626
A transponder is formed of a very thin flexible substrate (10) on opposite sides of which are formed first (26) and second (31) series connected halves of a single antenna coil having ends connected to an integrated circuit die (50) mounted to a corner of the substrate. A plurality of bond pads (12a-12e) and programming pads (14a-14e) are also formed on the substrate and operatively connected to couple the antenna coils and the programming pads through the bond pads to the integrated circuit die. Unique configurations and arrangements of a die mounting site (46), bond pads (12a- 12e), program pads (14a-14e), and vias (22, 24) through the substrate enable an inexpensive simple construction. Protective laminates (58, 60) on either side of the substrate are bonded to one another around the edges that circumscribe the substrate and also are bonded to one another at interior portions through a slot (20) formed in the substrate. In one embodiment narrow closely spaced coil turns are grouped in a perimetrical area of the substrate, leaving a large area in the center of the substrate free of antenna coil turns. The thin flexible substrate is stiffened in the area of the die and bond site by thin copper stiffener sheets (46, 202, 234) that are laid down as part of the antenna coil forming process.
Gowling Lafleur Henderson Llp
Hid Corporation
LandOfFree
Radio frequency identification transponder apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Radio frequency identification transponder apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radio frequency identification transponder apparatus and method will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1691041