Method of producing semiconductor substrate

C - Chemistry – Metallurgy – 30 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C30B 25/20 (2006.01) H01L 21/20 (2006.01) H01L 21/306 (2006.01) H01L 21/31 (2006.01) H01L 21/762 (2006.01)

Patent

CA 2059368

A method of producing a semiconductor substrate, which comprises forming a monocrystalline silicon layer on a porous silicon substrate by epitaxial growth and applying an oxidation treatment to the porous silicon substrate and the monocrystalline silicon layer at least near the interface between the porous silicon substrate and the monocrystalline silicon layer.

Méthode de fabrication d'un substrat semi-conducteur comprenant les étapes suivantes : former une couche monocristalline de silicium sur un substrat de silicium poreux par une croissance épitaxiale; et exécuter un traitement par oxydation sur le substrat de silicium poreux et la couche monocristalline de silicium au moins près de l'interface entre ces deux éléments.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method of producing semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing semiconductor substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1692882

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.