C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 59/00 (2006.01) C08L 23/04 (2006.01)
Patent
CA 2093669
2093669 9207033 PCTABS00012 Incorporation of 0.2 to 3.0 weight percent of linear low density polyethylene into polyoxymethylene compositions results in improved elongation for such compositions. The composition is useful in preparing semi-finished and finished articles by any of the techniques commonly used with thermoplastic materials.
E.i. Du Pont de Nemours And Company
Sim & Mcburney
LandOfFree
Polyoxymethylene compositions containing linear low density... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polyoxymethylene compositions containing linear low density..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyoxymethylene compositions containing linear low density... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1696765