C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 5/06 (2006.01) C09J 161/12 (2006.01) C09J 163/04 (2006.01)
Patent
CA 2721245
The present invention relates to an adhesive formulation in the form of an aqueous dispersion having a solids content of from 10 to 40% by weight based on the adhesive formulation for the treatment of reinforcing inserts for producing reinforced polymer products, wherein 100% by weight of the solid contains a) from 1 to 20% by weight of a bisphenol A epoxy novolak, b) from 0 to 20% by weight of a fully or partially blocked isocyanate, c) from 60 to 92% by weight of a resorcinol-formaldehyde latex (RFL).
La présente invention concerne une formulation adhésive sous forme de dispersion aqueuse ayant une teneur en matière solide comprise entre 10 et 40 % en poids par rapport à la formulation adhésive pour traiter des inserts de renfort, pour fabriquer des produits polymères renforcés, 100 % en poids de la matière solide contenant a) de 1 à 20 % en poids d'une novolaque à base de bisphénol A-époxy, b) de 0 à 20 % en poids d'un isocyanate totalement ou partiellement bloqué, c) de 60 à 92 % en poids d'un adhésif à base de résorcine-formaldéhyde-latex (RFL).
Ems-Patent Ag
Mcfadden Fincham
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