Semiconductor device package structure

Details Semiconductor device package structure Semiconductor device package structure

H - Electricity

05

K

356/3

H05K 7/20 (2006.01) H01L 21/56 (2006.01) H01L 23/31 (2006.01) H01L 23/433 (2006.01) H01L 23/498 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2017080

A semiconductor device of the package structure type includes a silicon chip that is mounted on a heat dissipation body, and a carrier film embedded in resin material. Each of input/output electrode portions of the silicon chip is connected electrically to each of lead wires of the carrier film. The electrical connection between the silicon chip and a circuit substrate is carried out by the carrier film. The heat dissipation body is exposed to a surface of the resin material. The resin material is fixed to a circuit substrate. A heat dissipation fin may be provided on the heat dissipation body.

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