B - Operations – Transporting – 32 – B
Patent
B - Operations, Transporting
32
B
B32B 7/12 (2006.01) B32B 15/04 (2006.01) H01L 23/14 (2006.01) H01L 23/36 (2006.01) H01L 23/373 (2006.01) H01L 23/433 (2006.01) H01L 23/495 (2006.01) H05K 3/30 (2006.01) H05K 1/02 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2066867
FM/6-18619/A Heat-conductive adhesive films, laminates with heat-conductive adhesive layers and the use thereof Abstract of the Disclosure A laminate comprising (a) a carrier having a heat conductivity of at least 10 W/mK and a thickness of 10 to 100 µm, and (b) a dielectric adhesive layer which is applied to at least one surface of said substrate and which contains a heat-conductive filler and has a thickness of 5 to 500 µm and a heat conductivity of 1 W/mK. The flexible laminate> or a dielectric and self-supporting adhesive film which contains a heat-conductive filler and has a heat conductivity of at least 1 W/mK, is suitable for removing heat from leadframes which have electrically insulated contact surfaces for electrical and electronic components and which are encapsulated with a synthetic resin moulding material, typically dual-in-line plastic packages, by bonding the rear sides of the contact surfaces to the leads.
Ciba Specialty Chemicals Holding Inc.
Fetherstonhaugh & Co.
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