Epoxy resin composition, prepreg and metal-clad laminate

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 63/02 (2006.01) B32B 15/08 (2006.01) C08G 65/48 (2006.01) C08J 5/24 (2006.01) C08L 63/00 (2006.01) C08L 71/12 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2353757

An epoxy resin composition of the invention comprises: an epoxy resin; a hardening agent; and a phenol-modified polyphenylene oxide having a number average molecular weight of 1000 to 4000, which is prepared by carried out a redistribution reaction between a polyphenylene oxide and a phenol compound in the presence of a reaction initiator which can be decomposed to generate an alcohol, a prepreg and a metal-clad laminate of the invention contain the epoxy resin composition.

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