Storage stable hot melt adhesives

Details Storage stable hot melt adhesives Storage stable hot melt adhesives

C - Chemistry, Metallurgy

08

G

C08G 8/04 (2006.01) C08G 8/10 (2006.01) C09J 161/04 (2006.01) C09J 161/06 (2006.01)

Patent

CA 2121841

2121841 9308223 PCTABS00021 One hundred percent thermosetting phenol/formaldehyde (P/F) resin and method of preparation thereof are disclosed. The resin comprises a molar ratio of F/P of about 1.2-1.7, has a softening point of about 80 ·C and cures at temperature of about 140-160 ·C. The method comprises heating the reactants in a solventless system in the presence of an ortho directing catalyst while monitoring the amount of free formaldehyde present in the reaction system.

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