Apparatus and process for cutting adhesive labels

B - Operations – Transporting – 26 – D

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B26D 7/10 (2006.01) B26F 1/38 (2006.01) B31D 1/02 (2006.01)

Patent

CA 2749388

A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.

L'invention concerne un procédé et un appareil permettant de découper à l'emporte-pièce un film à étiquettes comportant une pellicule frontale, un adhésif et éventuellement une doublure pour former des étiquettes, une doublure du film doublé à étiquettes autocollantes pouvant être une doublure mince ou ultra mince.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and process for cutting adhesive labels does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and process for cutting adhesive labels, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and process for cutting adhesive labels will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1749172

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.