Component-module-adapted oscillating circuit arrangement

Details Component-module-adapted oscillating circuit arrangement Component-module-adapted oscillating circuit arrangement

H - Electricity

03

H

H03H 9/05 (2006.01) H03B 1/00 (2006.01) H03B 5/32 (2006.01)

Patent

CA 2180164

A component-module-adapted oscillating circuit arrangement adapted to form a signal with a high frequency and a narrow frequency range includes a signal amplifying circuit, a signal generating circuit with a resonance element, required electrical wiring, and required matching network. On one surface of a carrier substrate belonging to the component module, electrically conductive surface sections are formed and distributed in such a way that they can coact in a firm and electrically conductive manner with corresponding contact surfaces of the resonance element. An integrated circuit is attached to the surface sections adjacent to the surface sections intended for the resonance element. This integrated circuit includes the required amplifying circuit. The contact surfaces of the resonance element are connected to the contact surfaces of the carrier substrate by bonding or the like. The integrated circuit includes further signal amplifying and/or signal processing circuits, and contact surfaces of the integrated circuit are connected to contact surfaces of the carrier substrate by bonding or the like.

Configuration de circuit oscillant adaptée pour un module de composants, adaptée pour former un signal de la bande des ondes décamétriques et à bande de fréquence étroite, qui comporte un circuit amplificateur de signaux, un circuit générateur de signaux doté d'un élément de résonance, les fils électriques requis et le réseau adaptateur requis. Sur une surface d'un substrat porteur appartenant au module de composants, des parties de surface électriquement conductrices sont formées et réparties de telle manière qu'elles peuvent agir conjointement d'une manière ferme et électriquement conductrice avec des surfaces de contact correspondantes de l'élément de résonance. Un circuit intégré est fixé sur les parties de surface adjacentes aux parties de surface destinées à l'élément de résonance. Ce circuit intégré comporte le circuit d'amplification requis. Les surfaces de contact de l'élément de résonance sont connectées aux surfaces de contact du substrat porteur par collage ou analogue. Le circuit intégré comporte d'autres circuits de traitement et/ou d'amplification de signaux et les surfaces de contact du circuit intégré sont connectées à des surfaces de contact du substrat porteur par collage ou analogue.

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