Apparatus for imprinting and/or embossing substrates

Details Apparatus for imprinting and/or embossing substrates Apparatus for imprinting and/or embossing substrates

H - Electricity

01

L

H01L 21/02 (2006.01) H01L 21/67 (2006.01) H01L 21/68 (2006.01)

Patent

CA 2628812

The invention relates to an apparatus for imprinting and/or embossing substrates (7), in particular semiconductor substrates or wafers, having: - a receiving unit (5) for receiving the substrate (7) in a working space (13), - an adjusting device (2, 3, 4) for adjusting the substrate (7) in relation to an embossing and/or printing punch (10), whereby for a process that is as contamination-free as possible and for a manufacture of the apparatus that is as favourable as possible the receiving unit (5) is designed so as to separate the working space (13) from the environment.

Affiliated with

Also associated with

Rating

Apparatus for imprinting and/or embossing substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for imprinting and/or embossing substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for imprinting and/or embossing substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1766613