Text probe interface assembly and manufacture method

Details Text probe interface assembly and manufacture method Text probe interface assembly and manufacture method

G - Physics

01

R

G01R 1/073 (2006.01)

Patent

CA 2358405

An interface module for testing integrated circuits and a method of manufacture are disclosed wherein a planar self supporting diaphragm (21) supports signal paths (22) connected to a pattern of probe contacts extending therefrom which are in registration with a pattern of integrated circuit access pads (26). The diaphragm is resiliently connected to a planar printed circuit board (11) in a plane substantially parallel to the plane of the printed circuit board (11). A floppy substrate (16) is placed between the printed circuit board (11) and the diaphragm (21) to provide signal paths from the printed circuit board (11) to the self supporting diaphragm (21). The method includes laser location and drilling of holes to obtain a high density of accurately positioned small diameter holes (23) in the self supporting diaphragm material (11) to thereby accomplish high probe contact density in unlimited pattern arrays.

L'invention concerne un module d'interface servant à tester des circuits intégrés, et un procédé de fabrication dudit module. Un diaphragme planaire autonome (21) comporte des parcours du signal (22) reliés à une configuration de contacts d'essai qui les prolongent et correspondent à une configuration de plots d'accès (26) au circuit intégré. Le diaphragme est connecté de manière souple à la carte imprimée planaire (11) sur un plan sensiblement parallèle au plan de la carte imprimée (11). Un substrat souple (16) est placé entre la carte imprimée (11) et le diaphragme autonome (21) pour constituer des parcours du signal entre la carte imprimée (11) et le diaphragme autonome (21). On décrit un procédé de localisation et de percement de trous par laser, qui permet d'obtenir une forte densité de trous (23) de petit diamètre placés avec précision dans le matériau à diaphragme autonome (21), ce qui donne une densité élevée de contacts d'essai dans des réseaux de configurations illimitées.

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