C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5929
C08L 63/00 (2006.01) C08L 33/04 (2006.01)
Patent
CA 2013868
- 20 - Abstract of the Disclosure: A thermosetting resin composition comprising the following components (a) to (c) wherein the ratio of (a)/(b) is in the range of 0.1 to 1.0 by weight: (a) an ethylene copolymer containing 0.5 to 10 by weight of a structure derived from a monomer having an acid anhydride group and 3 to 40 % by weight of a structure derived from an .alpha.,.beta.-unsatureated carboxylic acid ester monomer in the molecule, (b) a resin having an epoxy group, and (c) a curing agent for an epoxy resin, and a powder coating composition prepared therefrom, which are useful for coating underfloor parts of automobiles, building materials, various industrial materials, etc. which require corrosion protection and anti-chipping property.
Furukawa Kazunori
Hato Yuji
Nishizaki Ken
Todoroki Nobuaki
Kirby Eades Gale Baker
Shinto Paint Co. Ltd.
Sumitomo Chemical Company Limited
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