C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
C04B 14/18 (2006.01) C04B 26/04 (2006.01) C09D 5/02 (2006.01) E04F 13/02 (2006.01)
Patent
CA 2565674
The invention relates to a sealant compound comprising, in weight percent relative to the compound total volume: 40-60 % of mineral filler whose diameter d50 ranges from 5 to 20 microns, 5-10 % of hydrophobic expanded perlite whose diameter d50 ranges from 20 to 100 microns and 4-20 % of binder A method for preparing the inventive compound is also disclosed. Said invention also relates to producing a work provided with joints made of pointing and/or surfacing compound by applying said compound and/or pointing and surfacing by applying the compound which is characterised in that the compound is applied by airless process. According to the inventive method, said sealant compound is embodied such as described in the invention.
L'invention a donc pour objet un enduit comprenant, en pourcentages massiques rapportés à la masse totale d'enduit : de 40 à 60% d'une charge minérale ayant un diamètre compris entre 5 et 20 microns; de 5 à 10% de perlite expansée hydrophobée ayant un diamètre de compris entre 20 et 100 microns; et de 4 à 20% d'un liant. L'invention a aussi pour objet un procédé de préparation de l'enduit selon l'invention. L'invention a aussi pour objet un procédé de réalisation d'un ouvrage, comprenant le jointoiement avec un enduit et/ou le surfaçage par application d'un enduit, et/ou le jointoiement et le surfaçage par application d'un enduit, caractérisé en ce que l'enduit est appliqué par la technique Airless ou sans air. Selon un mode de réalisation, l'enduit est tel que décrit dans la présente demande.
Lafarge Platres
Norton Rose Or S.e.n.c.r.l. S.r.l./llp
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