Led bonding structures and methods of fabricating led...

Details Led bonding structures and methods of fabricating led... Led bonding structures and methods of fabricating led...

H - Electricity

01

L

H01L 33/62 (2010.01)

Patent

CA 2564309

An LED chip includes a bond pad suitable for thermosonic or thermocompression bonding such as Sn, AuSn or other metals. The physical dimensions of the bond pad are selected to discourage or prevent solder squeeze-out during thermocompression or thermosonic bonding with or without flux. In some embodiments, an AuSn bond pas is designed to accept 30g to 70g of force or more without squeeze-out.

L'invention porte sur une puce de DEL comportant un plot de connexion adapté à la soudure thermosonique ou par thermocompression de Sn, AuSn ou d'autres métaux. Les dimensions du plot sont choisies pour décourager ou empêcher l'écrasement de la soudure lors de la soudure thermosonique ou par thermocompression avec ou sans flux. Dans certaines exécutions, un plot d'AuSn bond peut tolérer des forces de 30g à 70g ou plus sans production d'écrasement.

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