C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 131/04 (2006.01) A47G 27/04 (2006.01) B05C 17/005 (2006.01) B29C 65/12 (2006.01) B29C 65/42 (2006.01) C09J 5/06 (2006.01) C09J 123/08 (2006.01) C08L 23/08 (2006.01) C08L 57/02 (2006.01)
Patent
CA 2189935
A method is disclosed for sealing and bonding the seams and edges of resilient and other types of floors, whereby specially formulated hot-melt sealants/adhesives are applied in molten form at the flooring installation site using a heated gun equipped with a specially designed tip. The hot- melt sealant/adhesive flows into and completely fills the seam and bonds to the edges of the flooring producing a bead of material that extends above the surface of the flooring. The specially designed tip facilitates this process by guiding along easily in the groove of the seam or joint and directing the molten sealant/adhesive accurately into the seam. The tip allows the seam or joint width to be very narrow and enhances sealing and adhesion by imparting heat to the edges of the flooring material. Upon cooling, a spatula knife or other appropriate tool is used to skive off the excess bead of material leaving it flush with the flooring. The appropriately pigmented sealant/adhesive produces an appearance that is barely noticeable from the surrounding floor.
Armstrong World Industries Inc.
Awi Licensing Company Inc.
Gowling Lafleur Henderson Llp
LandOfFree
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