C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 175/14 (2006.01) C08G 18/12 (2006.01) C08G 18/69 (2006.01)
Patent
CA 2262981
The invention concerns hot-melt adhesive (HMA) compositions in the form of polymer containing free isocyanate functions, said polymer resulting from the reaction of a polyisocyanate (A), a polyol polydiene (B) and an ethylene copolymer (C) containing hydroxyl functions. Said adhesives have a low viscosity and can therefore be used as from 110 ·C and they are moisture-setting.
L'invention concerne des compositions adhésives thermofusibles (HMA) se présentant sous forme de polymère contenant des fonctions isocyanates libres, ledit polymère résultant de la réaction d'un polyisocyanate (A), d'un polydiène polyol (B) et d'un copolymère (C) de l'éthylène contenant des fonctions hydroxyles. Elles ont une faible viscosité et peuvent donc être mises en oeuvre dès 110 ~C. Elles sont réticulables à l'humidité atmosphérique.
Flat Jean-Jacques
Lebez Jean
Pierrot Jean-Michel
Elf Atochem S.a.
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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