C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/02 (2006.01) B29C 67/04 (2006.01) C08G 69/14 (2006.01)
Patent
CA 2521684
Disclosed is a powder for use in a layer-by-layer molding process. The powder comprises a first polyamide or copolyamide regulated by a dicarboxylic acid; and a second polyamide or copolyamide regulated by a diamine. The layer-by layer process for producing a molding comprises selectively melting a region of a pulverulent layer comprising the powder and fixing the molding by cooling. The powder has an almost constant solution viscosity and is capable of repeated use in a rapid prototype (RP) or rapid manufacturing (RM) process without addition of virgin powder.
Altkemper Stefan
Baumann Franz-Erich
Christoph Wolfgang
Grebe Maik
Monsheimer Sylvia
Degussa Ag
Fetherstonhaugh & Co.
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