Powder with improved recycling properties, process for its...

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 77/02 (2006.01) B29C 67/04 (2006.01) C08G 69/14 (2006.01)

Patent

CA 2521684

Disclosed is a powder for use in a layer-by-layer molding process. The powder comprises a first polyamide or copolyamide regulated by a dicarboxylic acid; and a second polyamide or copolyamide regulated by a diamine. The layer-by layer process for producing a molding comprises selectively melting a region of a pulverulent layer comprising the powder and fixing the molding by cooling. The powder has an almost constant solution viscosity and is capable of repeated use in a rapid prototype (RP) or rapid manufacturing (RM) process without addition of virgin powder.

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