B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 65/08 (2006.01) B29C 65/00 (2006.01) B29C 65/78 (2006.01) B60J 10/00 (2006.01) B60J 10/02 (2006.01)
Patent
CA 2238386
The present invention discloses a method of melt-adhering a hard resin product to a substrate, wherein: a primer which includes a silane coupling agent is applied to a substrate which includes silicon, a hard resin product contacts a portion to which the primer has been applied, and the resin product is vibrated while pressure is applied thereto, and a melt-adhering apparatus which uses this method. A melt-adhering apparatus, comprising: a melt-adhering gun which includes a horn which can hold a resin product; a nipping stand which is movably disposed beneath the horn so that a substrate is nipped between the nipping stand and the horn; moving means which relatively moves the melt-adhering gun and the nipping stand; and a converter which subjects the horn to ultrasonic vibration in response to an input signal. In the present invention, the resin product can be securely melt-adhered to the substrate inexpensively.
Un substrat contenant du silicone est revêtu d'une couche d'accrochage contenant un liant au silane. Un article en résine dure est mis en contact avec la partie du substrat revêtu de la couche d'accrochage, puis ledit article est mis en vibration alors que l'article est pressé contre le substrat. L'appareil de soudage comporte: un canon de soudage comportant une corne qui maintient l'article; une table support pouvant se déplacer sous la corne et maintenant l'article entre la corne et elle-même; un moyen de transfert déplaçant le canon de soudage et la table support l'un par rapport à l'autre, et un convertisseur produisant des ultrasons dans la corne en fonction d'un signal d'entré. On peut ainsi souder fermement et économiquement un article en résine sur un substrat.
Fujiwara Kousyun
Sasaki Yoshio
Borden Ladner Gervais Llp
Toyota Jidosha Kabushiki Kaisha
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