B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 35/363 (2006.01) B23K 35/02 (2006.01) B23K 35/36 (2006.01) H01B 1/22 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 1/09 (2006.01) H05K 3/10 (2006.01) H05K 3/32 (2006.01) H05K 1/18 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2120523
Electrically conductive adhesive compositions and methods for the preparation and use thereof; in which a solder powder, a chemically protected cross-linking agent-with fluxing properties and a reactive monomer or polymer sue the principal components. Depending upon the intended end use; the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits; the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive-paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder.
Capote Miguel Albert
Craig Hugh P.
Manesis Nicholas John
Todd Michael George
Ormet Corporation
Oyen Wiggs Green & Mutala Llp
Toranaga Technologies Inc.
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