Spring clamp assembly for thermal stacked components

H - Electricity – 01 – L

Patent

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Details

H01L 23/34 (2006.01) H01L 23/40 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2302357

A spring clamp device (14) providing a compressive stress to a stack of components includes a spring member (28) and a bracket (26) having attachment structure for engaging mating structure near the bottom of the stack. The bracket (26) is first engaged with the mating structure such that is straddles the stack. The spring member (28) is then latched to the bracket (26) under tension in an assembled configuration, thereby applying an upward reaction on the mating structure with the attachment structure of the bracket (26) and applying a downward reaction force to the top of the stack with the spring member (28). The oppositely directed forces apply a compressive stress to the stack, which improves thermal contact between the components.

L'invention concerne un système (14) d'étrier à ressort exerçant une contrainte de compression sur une pile de composants. Ce système comprend un élément (28) ressort et un étrier (26) présentant une structure de fixation qui vient s'engager dans une structure complémentaire située à proximité du fond de la pile. On commence par assembler l'étrier (26) à la structure complémentaire de manière que l'étrier chevauche la pile de composants. L'élément (28) ressort est ensuite attaché sous tension à l'étrier (26), de manière à réaliser une configuration d'assemblage dans laquelle une force de réaction dirigée vers le haut est exercée par la structure de fixation de l'étrier (26) sur la structure complémentaire et une force de réaction dirigée vers le bas est exercée par l'élément (28) ressort sur le haut de la pile. Ces forces opposées exercent une contrainte compressive sur la pile ce qui améliore le contact thermique entre les composants.

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