Weakening wire supplied through a wire bonder

Details Weakening wire supplied through a wire bonder Weakening wire supplied through a wire bonder

H - Electricity

01

L

H01L 21/603 (2006.01) B23K 9/013 (2006.01) B23K 20/00 (2006.01) H01L 21/607 (2006.01)

Patent

CA 2071219

ABSTRACT OF THE DISCLOSURE A technique for weakening an interconnection wire provided on a contact on an electronic component, in which the wire is weakened by means of an arc which is created between the wire and an electrode provided in an aperture in the wall of the bonding head of the wire bonder through which the wire is supplied, the arc being generated by an electric field between the wire and the electrode. The electric field has a second portion in which its polarity is reversed, for controlling the dispersion of charged particles emitted from the wirer The electric field may be created by an arc generator which includes a capacitor which discharges through a transformer.

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