Sputtering apparatus with a rotating magnet array having a...

Details Sputtering apparatus with a rotating magnet array having a... Sputtering apparatus with a rotating magnet array having a...

C - Chemistry, Metallurgy

23

C

204/167.2

C23C 14/35 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2017206

A magnetron sputtering apparatus includes a rotatable magnet. At least a portion of the centerline of the magnet lies on a curve defined by Image where ~ (u) is a preselected erosion profile. When stationary, the magnet generates a localized magnetic field of approximately constant width. In operation, when the magnet is rotated, it generates the preselected erosion profile in the target. The preselected erosion profile may be constant.

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