Thermally conductive polyamide-based components used in...

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C - Chemistry, Metallurgy

08

L

C08L 77/06 (2006.01) C08K 3/00 (2006.01) H01L 25/16 (2006.01)

Patent

CA 2611270

Articles associated with light emitting diode assemblies are disclosed which are made from polyamide resin compositions and thermally conductive materials such as Al2O3, boron nitride, boron carbide, calcium fluoride, and aluminum nitride, and optionally fillers and/or additives.

L'invention concerne des articles associés aux assemblages comportant des diodes électroluminescentes, composés de résine polyamide, de matériaux thermoconducteurs tels que Al2O3, le nitrure de bore, le carbure de bore, le fluorure de calcium, et le nitrure d'aluminium, et éventuellement de charges et/ou d'additifs.

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