Structure of semiconductor ic chip

Details Structure of semiconductor ic chip Structure of semiconductor ic chip

H - Electricity

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H01L 23/50 (2006.01) H01L 23/14 (2006.01) H01L 23/24 (2006.01) H01L 23/433 (2006.01) H01L 23/482 (2006.01) H01L 23/485 (2006.01) H01L 23/488 (2006.01) H01L 23/49 (2006.01)

Patent

CA 2061522

A structure of semiconductor IC (Integrated Circuit) chip carrier feasible for a multi-terminal arrangement and high-speed signal propagation. Input/output terminals in the form of pins or bumps are directly provided on the circuit surface of an IC chip to serve as the leads of a chip carrier. A heat spreader is soldered or otherwise affixed to the rear of the IC chip and plays the role of the body of the chip carrier. The IC chip itself may be buried in the heat spreader by a seal resin.

L'invention est une structure de support de puce de circuit intégré à semi-conducteur multiborne permettant d'atteindre de grandes vitesses pour la transmission des signaux. Des bornes d'entrée-sortie en forme de broches ou de bosses sont créées directement sur la surface d'une puce de circuit intégré pour servir de conducteurs au support de la puce. Un diffuseur de chaleur est soudé ou fixé à l'arrière de cette puce et sert de corps au support de la puce. La puce peut elle-même être en capsulée dans le diffuseur de chaleur au moyen d'une résine d'étanchéification.

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