H - Electricity – 01 – J
Patent
H - Electricity
01
J
H01J 9/24 (2006.01) H01J 9/20 (2006.01)
Patent
CA 2352769
A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardered between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to removed the binder and optimally fired to sinter the ceramic powder.
L'invention concerne un procédé de moulage et d'alignement de microstructure sur un substrat à motifs à l'aide d'un moule microstructuré. Une suspension aqueuse contenant un mélange de poudre céramique et de liant fugace durcissable est placé entre la microstructure d'un moule étirable et un substrat à motifs. Le moule peut être étiré de manière à aligner la microstructure du moule sur une partie prédéterminée du substrat à motifs. La suspension aqueuse est durcie entre le moule et le substrat. Le moule est alors retiré pour que les microstructures se collent au substrat et soient alignées sur les motifs du substrat. Les microstructures peuvent être chauffées de manière à éliminer le liant et éventuellement cuites afin de fritter la poudre céramique.
Chiu Raymond C.
Dillon Kenneth R.
Hoopman Timothy L.
Humpal Paul E.
King Vincent W.
Minnesota Mining And Manufacturing Company
Smart & Biggar
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