Thermoplastic moulding compounds

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 25/02 (2006.01) C08L 25/04 (2006.01) C08L 25/06 (2006.01) C08L 25/08 (2006.01)

Patent

CA 2277851

The invention concerns thermoplastic moulding compounds containing (A) between 5 and 95 wt % of a vinylaromatic polymer having a syndiotactic structure, and (B) between 5 and 95 wt % of a copolymer of a vinylaromatic monomer and 1,1- diphenyl ethylene or its derivatives substituted at the aromatic rings optionally with alkyl groups having up to 22 carbon atoms.

L'invention concerne des matières de moulage thermoplastiques contenant: A) entre 5 et 95 % en poids d'un polymère vinylaromatique à structure syndiotactique et B) entre 5 et 95 % en poids d'un copolymère d'un monomère vinylaromatique et 1,1-diphényléthylène ou ses dérivés substitués au niveau des composés cycliques aromatiques éventuellement avec des groupes alkyle ayant jusqu'à 22 atomes de C.

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