Method and apparatus for repair of defects in materials with...

B - Operations – Transporting – 23 – K

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B23K 26/03 (2006.01) G03F 1/00 (2006.01) H01L 21/768 (2006.01)

Patent

CA 2397315

A method of accurately and precisely providing desired functionality to an electronic or opto-electronic component is disclosed in which a Femtosecond laser pulse is used to ablate material from a surface of or from within a component. The component is in active operation during the ablation process in order to facilitate the ablation process. The process also involves detection and feedback to indicate when a repair is sufficiently complete. The detection is also performed while the component is powered allowing in-situ detection and ablation. Of course, forms of facilitation other than feedback such as monitoring are also applicable to the invention.

La présente invention concerne un procédé permettant de donner de manière exacte et précise une fonctionnalité désirée à un composant électronique ou opto-électronique. Dans ledit procédé, une impulsion laser femtoseconde sert à l'ablation de matériau de la surface ou de l'intérieur d'un composant. Le composant se trouve en fonctionnement actif durant le processus d'ablation, de manière à faciliter ledit processus d'ablation. Le procédé permet également la détection et la rétroinformation afin d'indiquer lorsqu'une réparation est suffisamment complète. La détection est également réalisée lorsque le composant est en fonctionnement, ce qui permet le détection et l'ablation <i>in situ</i>. Des formes de simplification, autres que la rétroinformation, telles que la surveillance, peuvent bien entendu être également appliquées à l'invention.

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