Binder formulation for electro-dipping

Details Binder formulation for electro-dipping Binder formulation for electro-dipping

C - Chemistry, Metallurgy

09

D

C09D 5/44 (2006.01) C08G 18/64 (2006.01) C08G 18/80 (2006.01) C25D 3/02 (2006.01)

Patent

CA 2103488

Abstract of the Disclosure: A binder formulation for the electro-dipping process contains (A) a cathodic synthetic resin and (B) a compound which has a boiling point above 140°C and carries at least one allyl or vinyl group which is not directly bonded to a carbonyl group.

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