Organopolysiloxane composition for the formation of a cured...

C - Chemistry – Metallurgy – 08 – L

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C08L 83/07 (2006.01) C08L 83/04 (2006.01) C09D 183/04 (2006.01)

Patent

CA 2085821

ABSTRACT The instant invention pertains to an organopolysiloxane composition for the formation of a release film, that has a high curing rate at relatively low temperatures (< 100°C) and that forms a cured film that both adheres strongly to various types of substrates and is highly releasing for tacky or sticky substances. The organopolysiloxane composition for the formation of a cured release film of the instant invention comprises (A) organopolysiloxane that contains in each molecule at least 2 alkenyl groups with the general formula H2C=CH-(CH2)n-, wherein n = 2 to 8; (B) an organohydrogenpolysiloxane that contains in each molecule at least 2 silicon- bonded hydrogen atoms and at least 1 alkenyl group with the general formula H2C=CH-(CH2)n-, wherein n = 2 to 8; (C) an addition- reaction inhibitor; (D) platinum group metal catalyst; and optionally (E) a nonreactive organopolysiloxarle that contains neither silicon- bonded alkenyl nor silicon-bonded hydrogen.

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