Low dielectric inorganic composition for multilayer ceramic...

Details Low dielectric inorganic composition for multilayer ceramic... Low dielectric inorganic composition for multilayer ceramic...

C - Chemistry, Metallurgy

04

B

C04B 35/16 (2006.01) C03C 14/00 (2006.01) H01L 21/48 (2006.01) H01L 23/15 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2071778

LOW DIELECTRIC INORGANIC COMPOSITION FOR MULTILAYER CERAMIC PACKAGE A B S T R A C T A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/°C. from room temperature to 200°C. The composition comprises a mixture of finely divided particles of 20-50 wt.% borosilicate glass, 40-75 wt.% titanium silicate glass and where necessary sufficient amounts of crystalline ceramic material to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

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