Method of ablating an opening in a hard, non-metallic substrate

Details Method of ablating an opening in a hard, non-metallic substrate Method of ablating an opening in a hard, non-metallic substrate

B - Operations, Transporting

23

K

B23K 26/38 (2006.01) B28D 1/22 (2006.01) C03B 33/08 (2006.01) C03C 23/00 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2451077

A method of ablating a hole into a hard, non-metallic substrate(24) is disclosed. At least on laser assembly (12) capable of generating a laser beam (16a) in an axis having a focus that is moveable relative to the axis is provided. A focus of the laser beam (16a) is positioned adjacent at least one surface of the substrate (24). A first layer (Pass-1) of the substrate (24) is ablated by the laser beam (16a). The focus is moved relative to the axis corresponding to the depth of the substrate (24) thereby enabling ablation of successive layers (Pass 2-10) of the substrate (24) are ablated to generate a hole (32) into the substrate (24).

Cette invention porte sur un procédé d'ablation d'un trou dans un substrat (24) dur non métallique. On utilise au moins un ensemble laser (12) pouvant générer un faisceau laser (16a) dans un axe dont le foyer est mobile par rapport à l'axe. Un foyer du faisceau laser (16a) est positionné à proximité d'au moins une surface du substrat (24). Une première couche (étape 1) du substrat (24) est retirée par le faisceau laser (16a). Le foyer est déplacé par rapport à l'axe correspondant à la profondeur du substrat (24), ce qui permet l'ablation de couches successives (étapes 2 à 10) du substrat (24) afin qu'un orifice (32) soit généré dans le substrat (24).

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