Method and device for the wet processing of substrates in a...

Details Method and device for the wet processing of substrates in a... Method and device for the wet processing of substrates in a...

B - Operations, Transporting

05

C

32/74, 32/82

B05C 3/109 (2006.01) B01D 21/24 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2217777

Proposed is a method for wet-processing substrates in a vessel into which a liquid is fed and is removed again through an overflow device. The method is particularly simple to carry out if the overflow device floats on the liquid and descends and/or rises as the liquid surface descends and/or rises. No mechanical devices are needed to raise the substrates and remove them from the liquid. Also proposed are devices for the wet-processing of substrates by the method proposed.

Procédé pour le traitement de substrats par voie humide, utilisant un récipient dans lequel un fluide est introduit et évacué par un dispositif à trop-plein, ledit procédé pouvant être mis en oeuvre suivant un processus particulièrement simple et avec des moyens simples grâce au fait que le dispositif à trop-plein flotte sur le fluide et s'abaisse et/ou s'élève en même temps que la surface du fluide. Aucun moyen mécanique n'est nécessaire pour soulever le substrat et le retirer du fluide. L'invention concerne en outre des dispositifs pour le traitement de substrats par voie humide pour la mise en oeuvre du procédé précité.

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