Printed circuit assembly having locally enhanced wiring density

Details Printed circuit assembly having locally enhanced wiring density Printed circuit assembly having locally enhanced wiring density

H - Electricity

05

K

H05K 1/14 (2006.01) H05K 3/36 (2006.01) H05K 3/46 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2351421

A printed circuit assembly (100) and method of making the same facilitates the attachment of high density modules (120) onto a printed circuit board (110). In one embodiment, the high density modules are attached to the printed circuit board using an adhesive having a conductive material disposed within at least one via. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incoporating conductive posts that are deposited on one of a pair of contact pads formed on a module that opposes a printed circuit board and is thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations. The conductive posts may also comprise a conductive ink.

L'invention concerne un ensemble circuit imprimé (100) et son procédé de fabrication, favorisant la fixation de modules à haute densité (120) à la plaquette de circuit imprimé (110). Dans un mode de réalisation, les modules à haute densité sont fixés à la plaquette de circuit imprimé à l'aide d'un adhésif comportant un matériau conducteur situé dans au moins un trou d'interconnexion. Dans un autre mode de réalisation de l'ensemble circuit imprimé, le procédé de fabrication consiste à utiliser une technique d'interconnexion des couches intermédiaires faisant usage de montants conducteurs déposés sur l'une des deux plages de contact formées sur un module qui est opposé à la plaquette de circuit imprimé puis lié à l'autre plage de contact de la paire au cours de la lamellisation. On peut utiliser une matière fusible dans les montants conducteurs pour faciliter la liaison mécanique à une plage de contact, les montants faisant saillie à travers une couche diélectrique disposée entre les plaquettes de circuits imprimés et constituant de cette manière les connexions électriques entre les plaquettes en des emplacements discrets. Les montants conducteurs peuvent également comporter de l'encre conductrice.

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