Multi-wafer polishing tool

Details Multi-wafer polishing tool Multi-wafer polishing tool

H - Electricity

01

L

H01L 21/02 (2006.01) B24B 27/00 (2006.01) B24B 37/04 (2006.01) B24B 41/06 (2006.01) H01L 21/304 (2006.01)

Patent

CA 2288621

A wafer polishing tool is disclosed which includes a polishing platen which is rotatable about a central platen axis, and a wafer carrier which supports a wafer for rotational movement to cause a portion of a surface of the wafer to only intermittently contact a polishing surface of the platen while the wafer rotates. The polishing tool may include a plurality of vertically stacked polishing platens which are rotatable about a central platen axis, and a plurality of stacked wafer carriers, wherein each carrier supports a wafer for rotational movement and vertical movement into contact with one of the polishing platens. During polishing, the carrier pack maintains the wafers in uninterrupted contact with the platen over less than entire surfaces of the wafers.

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