Laser diode assembly

Details Laser diode assembly Laser diode assembly

H - Electricity

01

S

H01S 3/04 (2006.01) H01L 21/20 (2006.01) H01S 5/40 (2006.01) H01S 5/02 (2006.01)

Patent

CA 2306140

A stacked array embodiment (20) provides for efficient cooling of the diode bars (30, 30') and electrical connection between diode bars (30, 30') while maximizing alignment of the diode bars (30, 30'). The spacers (26, 27, 28) are connected to a conductive surface (34) on a heat spreader (24). In the stacked array, one or more diode bars (30, 30') are alternated in series with two or more conductive spacers (26, 27, 28), with a series circuit provided from diode bar (30'). Alternatively, thermally conductive separator fins (38, 38') situated between the spacers (26-28) to contact the diode bars (30, 30') situated between the spacers (26-28) to promote rapid heat transfer from the diodes while maintaining the diode bars (30, 30') electrically isolated from the conductive layer (34) on the substrate (24).

L'invention porte sur un procédé et un appareil relatifs à un ensemble de barres de diodes de laser. Un empilement (20) assure le refroidissement efficace des barres de diodes (30, 30') ainsi qu'une liaison électrique entre les barres de diodes (30, 30') tout en renforçant leur alignement. Des entretoises (26, 27, 28) sont fixées à une surface conductrice (34) du radiateur (24). Une ou plusieurs des barres de diodes (30, 30') de l'empilement alternent en série avec deux ou plus de deux entretoises (26, 27, 28) conductrices, avec un circuit monté en série reliant la barre de diodes (30) à la barre de diodes (30'). En variante, des ailettes (38, 38') de séparation relient le substrat (24) du radiateur aux barres de diodes (30, 30') comprises entre les entretoises (26, 28) pour favoriser une évacuation rapide de la chaleur des diodes tout en maintenant les barres de diodes (30, 30') isolées électriquement de la couche (34) conductrice du substrat (24).

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